二氧化碳激光器（CO₂激光器）

有源晶振（石英晶体振荡器）主要应用于工业设备中，如数字系统、数控机床设备、数控激光切割机、钣金设备、印花设备、锁相环系统、调制解调器、船舶、电信、传感器以及磁盘驱动器等中。

以二氧化碳激光器（CO₂激光器）为例：

二氧化碳激光器发出的激光波长为10.6 微米，“身”处红外区，肉眼不能觉察，它的工作方式有连续、脉冲两种，用于激光切割，焊接，钻孔和表面处理。

二氧化碳激光器的功率分为高功率和低功率两种。高功率CO2激光器作为商业应用激光可达45千瓦，这是的物质处理激光，经常用来做工业的切割机，而低功率激光器常常用来雕刻。此外，由于水在二氧化碳激光器的发光频率极容易挥发，因此也常常被用来做激光嫩肤 ，磨皮等激光手术。

高功率CO2激光器常用到的晶振为电压为5V，输出负载为30pF的大功率有源晶振，以晶诺威科技产OSC7050有源晶振100MHz为例，其规格参数如下：

• Nominal Frequency 标称频率：100MHz
• Size尺寸: 7.0mm*5.0mm
• Power Voltage (±10%)电源电压: +5V
• Output Load(输出负载）: 30pF
• Output Waveform 输出波形: CMOS
• Operating Temperature工作温度:-40 ~ +85℃
• Frequency Stability频率稳定性：±25ppm(-40 ~ +85 ℃)
• Output Character: “0” Level 10%VDD Max. “1” Level 90%VDD Min
• Rise Time上升时间: (Tr) 10% ~ 90%VDD 10ns Max.
• Fall Time:下沿时间 (Tf) 90% ~ 10%VDD 10ns Max.
• Symmetry占空比: 60/40 to 40/60 at 50%VDD
• Current Consumption功耗: (Icc) 20 mA Max.
• Stand-by Current待机电流: (#1 pin = “ L” Level): (I_std) 10 uA Max.
• Start-up Time启动时间: 5 ms Max.
• Phase Jitter相位抖动: 1ps Max. (F offset : 12KHz ~ 20MHz)
• Storage Temp.存储温度: -55 ℃ ~ +125 ℃

晶诺威科技产OSC7050有源晶振100MHz焊盘脚位说明如下：

拓展阅读：About laser cutting technology 关于激光切割技术

Laser cutting technology is a non-contact cutting process that uses a high-power laser beam to cut various materials, including metals, plastics, ceramics and composite materials. The laser beam is generated by laser source and focuses beam on material through a series of mirrors and lenses. The laser beam melts, vaporizes or burns the material to form a narrow slit with high precision and accuracy. Laser cutting is a highly versatile process which can cut materials into various thicknesses and shapes, including straight lines, curves, angles and contours.

激光切割技术是一种非接触式切割工艺，利用高功率激光束切割各种材料，包括金属、塑料、陶瓷和复合材料等。激光束由激光源产生，并通过一系列的反射镜和透镜聚焦在材料上。激光束将材料熔化、蒸发或燃烧，以的精密度和准确度形成窄缝。激光切割是一种高度通用的工艺，可以将材料切割成各种厚度和形状，包括直线、曲线、角度和轮廓。

Laser cutting has a wide range of applications激光切割具有广泛的应用领域

Automotive industry汽车工业

Laser cutting is commonly used in cutting automotive metal and plastic parts such as body panels, exhaust systems and engine components.

激光切割常用于切割汽车金属和塑料部件，如车身覆盖件、排气系统和发动机部件。

Aerospace industry航空航天领域

Laser cutting can produce complex and intricate aircraft parts made of metals and composites such as turbine blades, engine components and structural components.

激光切割可以生产由金属和复合材料制成的复杂精密的飞机零部件，如涡轮叶片、发动机部件和结构部件等。

Medical industry医药领域

Laser cutting is used in the production of medical devices, such as surgical instruments, implants and prostheses. The technology is used to produce high quality medical equipments which are made of titanium, stainless steel and plastics such as stents, catheters and implants.

激光切割用于的生产，如、植入物和假体。该技术用于生产高品质的钛、不锈钢、塑料等，如支架、导管、植入物等。

Electronics industry电子领域

Laser cutting is also used in the electronics industry for cutting electronic components such as PCB, microchips, semiconductor wafers and sensors.

激光切割也用于电子行业，用于切割PCB、微芯片、半导体芯片和传感器等电子元件。