NDK晶振NX3225SA-25.000MHz-STD-CRS-2主要电气参数

• 晶振品牌: NDK
• Package and Size封装尺寸：SMD3225
• Type类型：无源贴片晶振，晶体谐振器
• Nominal frequency 标称频率：25.000MHz
• Overtone order 振荡模式：基频
• Frequency tolerance调整频差：±15PPM max. (at +25°C)
• Frequency versus temperature characteristics温度频差： ±50PPM max.
• Equivalent resistance等效阻抗 ：100Ω max
• Load capacitance (CL) 负载电容：8pF
• Drive Level 激励功率: 10μW （200 μW.）
• Storage temperature range存储温度：-40~+125°C
• Insulation resistance 绝缘阻抗：500MΩ

NDK晶振NX3225SA-25.000MHz-STD-CRS-2详细电气参数

NDK晶振NX3225SA-25.000MHz-STD-CRS-2 Outline and pin connection外型尺寸及引脚说明

Notes on storage存储说明

1 When storing the product in high temperature and high humidity condition for a long time, product characteristics (solderability etc.) and packaging condition may be deteriorated. Please store product at temperature + 5°C ~ + 35°C, humidity 85% RH or less. The product is an electronic component, so please do not storage and use, under a dewing state.
当本产品在高温高湿条件下长时间储存时，产品电气特性（可焊性等）且包装状况可能恶化。请将本产品存放在温度+5℃~+35°C，相对湿度85%或更低的环境下存储。本产品为电子元件，因此请勿在结露状态下储存和使用。

2 The product storage deadline is 12 months after delivery in unopened state. Please use within storage deadline. If you exceed storage deadline, please check the product characteristics etc, please use.
本产品在未开封状态下的贮存期限为交货后12个月，请在存储期限内使用。如果日期已超，请在使用之前对其电气特性再次确认。

焊接说明

Be sure to use the product under the following conditions. Otherwise, the characteristics deterioration or destruction of the product may result.
请务必在以下条件下使用该产品。否则，可能导致本产品的性能恶化或破坏。

(1) Reflow soldering heat resistance回流焊耐热性

Peak temperature温度： 265℃，时长10 sec
Heating加热: 230℃ or higher, 时长40 sec
Preheating预热: 150℃ ~ 180 ℃, 时长120 sec
Reflow passage times回流焊次数: 两次

(2) Manual soldering heat resistance手工焊接耐热性
Pressing a soldering iron of 400℃ on the terminal electrode for four seconds (twice).
将400℃的烙铁压在晶振电极末端4秒（两次）。